High-Density Immersion Cooling Chassis for AI Clusters | China Suppliers & Factory Solutions
The Immersion Cooling Chassis for High Density is a professional liquid cooling chassis designed for high-density computing scenarios such as AI training clusters, GPU server clusters, high-performance computing HPC and big data center server groups. Different from traditional air-cooled chassis relying on fan air dissipation, this chassis adopts full immersion liquid cooling technology, putting server mainboard, CPU, GPU and other heat-generating components into non-conductive insulating dielectric liquid, directly taking away heat through liquid heat conduction, with higher heat exchange efficiency and more stable temperature control.
The chassis is made of anti-corrosion and anti-leakage aluminum alloy material as a whole, with sealed structural design to effectively prevent internal dielectric liquid leakage, and at the same time isolate external dust, moisture and oxidizing gas, reduce hardware aging speed and extend server service life. It supports high-density multi-node server deployment in a single chassis, greatly improving the number of computing units per unit area and saving data center construction space and site cost. The internal liquid circulation and heat exchange structure is optimized, which can keep the hardware working temperature stable at 35-45°C for a long time, far lower than the high temperature state of traditional air cooling, allowing CPU and GPU to run at full load for a long time without frequency reduction.
Equipped with built-in liquid level sensor and temperature monitoring module, it can real-time feed back internal liquid level and temperature data, and automatically alarm when abnormal parameters occur to ensure system operation safety. The dielectric liquid used is non-toxic, non-flammable and environmentally friendly, with long service life and low later maintenance cost. It eliminates the need for server cooling fans and large air conditioning equipment in the computer room, greatly reducing overall power consumption and operation cost of the data center. This high-density immersion cooling chassis is an essential core hardware for building low-energy consumption, high-efficiency and high-stability modern AI computing data center.