China Suppliers Factory Immersion Cooling Chassis for AI Computing Clusters and High-Density GPU Servers
The Immersion Cooling Chassis for High Density is a professional liquid cooling chassis designed for high-density computing scenarios such as AI training clusters, GPU server clusters, high-performance computing HPC and big data center server groups. Different from traditional air-cooled chassis relying on fan air dissipation, this chassis adopts full immersion liquid cooling technology, putting server mainboard, CPU, GPU and other heat-generating components into non-conductive insulating dielectric liquid, directly taking away heat through liquid heat conduction, with higher heat exchange efficiency and more stable temperature control.
The chassis is made of anti-corrosion and anti-leakage aluminum alloy material as a whole, with sealed structural design to effectively prevent internal dielectric liquid leakage, and at the same time isolate external dust, moisture and oxidizing gas, reduce hardware aging speed and extend server service life. It supports high-density multi-node server deployment in a single chassis, greatly improving the number of computing units per unit area and saving data center construction space and site cost. The internal liquid circulation and heat exchange structure is optimized, which can keep the hardware working temperature stable at 35-45°C for a long time, far lower than the high temperature state of traditional air cooling, allowing CPU and GPU to run at full load for a long time without frequency reduction.
Equipped with built-in liquid level sensor and temperature monitoring module, it can real-time feed back internal liquid level and temperature data, and automatically alarm when abnormal parameters occur to ensure system operation safety. The dielectric liquid used is non-toxic, non-flammable and environmentally friendly, with long service life and low later maintenance cost. It eliminates the need for server cooling fans and large air conditioning equipment in the computer room, greatly reducing overall power consumption and operation cost of the data center. This high-density immersion cooling chassis is an essential core hardware for building low-energy consumption, high-efficiency and high-stability modern AI computing data center.
Q: What computing scenarios is this immersion cooling chassis designed for?
It is designed for high-density computing environments, including AI training clusters, GPU server clusters, high-performance computing (HPC), and big data center server groups.
Q: How does the immersion cooling technology work?
Instead of using traditional fan air dissipation, this chassis submerges the server mainboard, CPU, GPU, and other heat-generating components directly into a non-conductive insulating dielectric liquid. Heat is directly carried away through liquid heat conduction for better efficiency and stability.
Q: How does the chassis prevent leaks and protect hardware?
The chassis is constructed from anti-corrosion and anti-leakage aluminum alloy with a sealed structural design. This prevents dielectric liquid leakage while isolating external dust, moisture, and oxidizing gases to reduce hardware aging.
Q: What operating temperatures can the chassis maintain?
The optimized internal liquid circulation and heat exchange structure keeps the hardware working temperature stable at 35-45°C, enabling CPUs and GPUs to run at full load without frequency reduction.
Q: What safety monitoring features are included?
It features a built-in liquid level sensor and temperature monitoring module that provides real-time data feedback and triggers automatic alarms if abnormal parameters are detected.
Q: Is the dielectric liquid safe and environmentally friendly?
Yes, the dielectric liquid is non-toxic, non-flammable, and environmentally friendly. It offers a long service life and low maintenance costs while eliminating the need for server cooling fans and large computer room air conditioners.